Micron Introduces New Memory for Ultrathin Devices


Micron announced this morning that it was unveiling a "reduced-height" module and connector solutions to support the ever-expanding ultrathin computing market.

Micron officials said their new single-sided small outline dual in-line memory module is built using components that consume less power in standby compared to existing technology. The new SODIMM is aimed at providing memory solutions for the burgeoning market of Ultrabook devices, tablets and other thin and light devices.

"Given the depth and breadth of ultrathin devices currently on the market, coupled with consumer demands for sleek, lightweight designs, Micron's objective is to offer solutions that meet the specialized power, portability and battery life needs," said Kris Kido, Micron's director of Business Development, Computing Devices. "Micron's unique single-sided SODIMM form factor meets those requirements and leads the way for future developments in this growing segment."

Mass production of the SODIMM's is expected to ramp up this spring.

In August 2012, Micron CEO Mark Durcan reminded attendees of the City Club that the Boise-based company reported net sales of $8.7 billion in 2011.

"Micron's [research and development] building at our Boise campus opened with a $150 million investment that will soon total a cumulative investment of over $500 million," said Durcan. "I think it's fair to say that it's the preeminent R and D center in the world."

But Durcan added that 68 percent of Micron's revenue comes from Asian markets, 21 percent from the Americas and 11 percent from Europe.